Evaluation Findings of Bondade CU-31 Bonding Solution: Technical Evaluation Report

Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center.

The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportdescribes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.